Components for current microrobots often rely on traditional semiconductor fabrication techniques for production. Prior research has developed components for jumping microrobots which use separately fabricated and manually assembled electrostatic inchworm motors and elastomer springs. A process is being developed to integrate the fabrication of a soft elastomer with traditional silicon semiconductor fabrication processes. This will allow for a new breed of microelectromechanical systems (MEMS) devices, especially energy storage devices. One method of actuation of microrobots is storing and quickly releasing energy, generating a high power for a short period of time. Research using the silicon and elastomer fabrication process will develop a new generation of high work density electrostatic motors and components capable of storing and rapidly releasing energy in elastomer springs for various MEMS applications, particularly microrobots. Fabrication begins with a deep reactive ion etch (DRIE) of high aspect ratio re-entrant trenches in the device layer of a silicon-on-insulator (SOI) wafer. These trenches are refilled with an elastomer such as polydimethylsiloxane (PDMS). The PDMS layer is planarized to remove excess elastomer and to allow for additional photolithography. Another DRIE step is performed to etch additional trenches to pattern the silicon and elastomer components. A hydrofluoric acid etch is used to release the devices.